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Credence Engineering Inc. |
LTCC and HTCC Process Equipment |
VF-8 EXTRUSION VIA FILL SYSTEM |
VF-1 Developed in 1989 for Medtronic Click Image to see video of this system still in operation in 2008 |
The Credence VF-8 is based upon the VF-1 extrusion Via Fill technology developed in 1987 at Medtronic. This method will go far beyond the 1:1 aspect ratio that limits screen print Via Filling. We have filled .004" Diameter vias through .188" thick solid fired ceramic plate with high success. When it comes to shrinking your via geometry down to .002" and smaller, the only way you will fill them is with a Credence VF-8. The extrusion process is simple and inexpensive. You punch a copper mask on your via punch machine along with each tape layer and use that mask in the Via Fill Process to fill the tapes. There is no investment in Via Fill Screens and there is no tying up a $200,000 printer to do Via Fill. The VF-8 yields higher, has better fill, has less bleed-out and it is just an overall better process. The Via Fill Tool Set is manually lifted out of the Carriage and another Tool Set already setup ahead of time is dropped in place ready to go. Changeover is less than a minute. The pressure and time settings are all manually set very easily keeping the cost where you want it, in the press and Tooling Set. Consider the VF-Via Fill System from Credence Engineering. There is no better or simpler method. |
Credence Engineering Incorporated, 237 W. La Vieve Ln., Tempe, Arizona, USA, Ph: USA-480-752-9776, E-Fax: USA-602-798-8277 |